MP30-AR0/MP30-AR1 Quick Reference Guide/ 快速测试参考指南
No. Code Descripon
1 LED_STA System status LED
2 USB2_MLAN KVM Server Management 10/100/1000 LAN port (top)/USB 2.0 ports (boom)
3 VGA1_COM1 Serial port (top)/VGA port (boom)
4 SFP+_1_2 SFP+ LAN port #1/#2
5 LAN1_2 GbE LAN port #1/#2
6 SW_PWR Power/Reset buon with LED
7 SW_ID ID switch buon with LED
8 CPU_FAN CPU fan connector
9 DIMM_P0_A0 Channel 1 slot 0
10 DIMM_P0_A1 Channel 1 slot 1
11 DIMM_P0_B0 Channel 2 slot 0
12 DIMM_P0_B1 Channel 2 slot 1
13 CPU0 AppliedMicro® X-Gene 1 processor
14 P12V_AUX 14 pin power connector
15 ATX1 24 pin main power connector
16 SYS_FAN1 System fan connector#2
17 FP_1 Front panel header (for Server system)
18 SYS_FAN2 System fan connector#3
19 PMBUS PMBus header
20 CLR_CMOS Clear CMOS jumper
No. Code Descripon
21 SYS_FAN3 System fan connector#3
22 BP_1 HDD back plane board header
23 CASE_OPEN Case open intrusion alert header
24 IPMB IPMB connector
25 SYS_FAN4 System fan connector#4
26 SATA_DOM0 SATA port 1 DOM support jumper
27 SATA1 SATA 3 6Gb/s connector
28 SATA0 SATA 3 6Gb/s connector
29 SATA3 SATA 3 6Gb/s connector
30 SATA2 SATA 3 6Gb/s connector
31 PCIE_2 PCI Express x16 slot (PCIe x8 Signal)
32 BAT Baery socket
33 PCIE_1 PCI Express x16 slot (PCIe x8 Signal)
34 LED_BMC BMC firmware readiness LED
35 DIMM_P0_C0 Channel 3 slot 0
36 DIMM_P0_C1 Channel 3 slot 1
37 DIMM_P0_D0 Channel 4 slot 0
38 DIMM_P0_D1 Channel 4 slot 1
1 2 3 4 5 67
8
9
12
13
14
151617181920
21
22
23
24
25
26
28
29
30
27
31
32
33
34
35
36
37
38
11
10
2
1
Front Panel Header/ HDD Back Plane Board Header/ 硬盤背板排針
1
24
23
2
No. Pin Define
1 Power LED+
3 No Pin
5 Power LED-
7 HDD LED+
9 HDD LED-
11 Power Buon
13 GND
15 Reset Buon
17 GND
19 ID Buon
21 GND
23 NMI Switch-
No. Pin Define
2 5V Standby
4 ID LED+
6 ID LED-
8 System Status LED+
10 System Status LED-
12 LAN1 Acve LED+
14 LAN1 Acve LED-
16 SMBus Data
18 SMBus Clock
20 Case Open
22 LAN2 Acve LED
24 LAN2 Acve LED-
1 2
25 26
No. Pin Define
1 BP_SGP_CLK
3 BP_SGP_LOAD
5 BP_SGP_DOUT
7 Key Pin
9 GND
11 BP_LED_G_N
13 BP_SGP_DIN
15 GND
17 GND
19 P_3V3_AUX
21 P_3V3_AUX
23 GND
25 PRESENCE
No. Pin Define
2 No Connect
4 FAN_Gate
6 GND
8 Reset
10 BP_LED_A_N
12 GND
14 No Connect
16 SMB_BP_DATA
18 SMB_BP_CLK
20 BMC_ACK
22 BMC_REQ
24 Key Pin
26 GND
ATX Power/
No. Pin Define
1 3.3V
2 3.3V
3 GND
4 +5V
5 GND
6 +5V
7 GND
8 Power Good
9 5VSB
10 +12V
11 +12V
12 3.3V
No. Pin Define
1 GND
2 GND
No. Pin Define
13 3.3V
14 -12V
15 GND
16 PS_ON
17 GND
18 GND
19 GND
20 -5V
21 +5V
22 +5V
23 +5V
24 GND
21
43 No. Pin Define
3 +12V
4 +12V
1
13
12
24
1
5
No Pin Define
1 SMB CLK
2 SMB DATA
3 SMB ALERT
PMBUS
No Pin Define
4 GND
5 3.3V
Memory Populaon Configuraon/ 安装内存
1 Slot
1DPC 1DPC 2DPC
A0 or C0
8 Slot
2DPC
Insert Full
A0+B0
or
A0+C0
1DPC
A0+B0
and
C0+D0
2DPC
A0+A1+B0+B1
or
A0+A1+C0+D0
A0+A1
or
C0+C1
2 Slot 4 Slot
Single DIMM per channel(1DPC) or Dual DIMMs per channel(2DPC) setting
Rear I/O Connector/后面板接口
Off
State Description
Yellow On 1Gbps data arte
Green On 100Mbps data arte
10Mbps data arte
10/100/1000 LAN LED:
State Description
Green On
Green Blink
Yellow On
Yellow Blink
Off
10 Gbps data rate
Identify 10 Gbps data rate
1 Gbps data rate
Identify 1 Gbps data rate
100 Mbps data rate
SFP+ LAN LED:
State Description
Green On System is operating normally.
Green Blink
Degrade condition, may indicates the following:
CPU failure
DIMM killed
Amber On
Critical condition, may indicates the following:
Power module failure
System fan failure
Power supply voltage issue
System temperature/voltage issue
Amber Blink
Non-critical condition, may indicates the following:
Redundant power module failure
Temperature and voltage issue
Chassis intrusion
N/A
System is not ready. May indicates the following:
POST error
NMI error
Processor or terminator missing
System Status LED:
Speed LED Link/Acvity
LED
Speed LED Link/Acvity
LED
Speed LED Link/Acvity
LED
No. Desripon
1 GbE LAN ports
2 SFP+ LAN ports
3 Serial port
4 VGA port
5 KVM Server Management 10/100/1000 LAN port (Dedicated LAN port)
6 USB 2.0 ports
7 System Status LED
系统状态LED:
绿色恒亮
绿色闪烁
橙色恒亮
橙色闪烁
颜色/状态 说明
。
无亮灯
效能降低情形，可能为下列状况：
处理器问题
内存问题
严重情形，可能为下列状况：
电源模块故障
系统风扇故障
电源电压问题
系统温度/电压问题
非严重情形，可能为下列状况：
冗余电源模块故障
系统温度/电压问题
机箱侵入
系统未正常运行，可能为下列状况：
POST错误
NMI错误
处理器或终结器缺失
SATA Connector/SATA 接口
No. Pin Define
1 GND
2 TXP
3 TXN
4 GND
7
1
No. Pin Define
5 RXN
6 RXP
7 GND
BMC Firmware Readiness LED
State Descripon
On BMC firmware is inial
Blink BMC firmware is ready
Off AC loss
BMC Firmware Readiness LED (LED_BMC):
CPU/System FAN/
14
4
1
No. Pin Define
1 GND
2 +12V
3 Sense
4 Speed Control
IPMB
No. Pin Define
1 Clock
2 GND
3 Data
31
Jumper Sengs/ 跳线设置
No. Desripon
1 Clear CMOS Jumper
1-2 Close: Normal operaon (Default seng)
2-3 Close: Clear CMOS data.
2 SATA Port 1 DOM Support Jumper Jumper
1-2 Close: Enable SATA port DOM support funon.
2-3 Close: Normal Operaon. (Default seng)
If a SATA type hard drive is connected to the
motherboard, please ensure the jumper is
closed and set to 2-3 pins (Default seng),
in order to reduce any risk of hard disk
damage.
1
2
Definition
P5V
SATA1 Pin7
3GND
Pin No.
Open: Normal operaon.
Closed: Acve chassis intruson alert.
Chassis Intrusion Alert Header
1
1
2 2
3
4
7
6
5
PN
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The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other
waste. Instead, the device should be taken to the waste collecon centers for acvaon of the treatment, collecon, recycling and
disposal procedure. The separate collecon and recycling of your waste equipment at the me of disposal will help to conserve
natural resources and ensure that it is recycled in a manner that protects human health and the environment.
For more informaon about where you can drop off your waste equipment for recycling, please contact your local government
office, your household waste disposal service or where you purchased the product for details of environmentally safe recycling.
When your electrical or electronic equipment is no longer useful to you, "take it back" to your local or regional waste
collecon administraon for recycling.
If you need further assistance in recycling, reusing in your "end of life" product, you may contact us at the Customer Care
number listed in your product's user's manual and we will be glad to help you with your effort.
GIGABYTE产品未故意添加和使用有害物质（Cd、Pb、Hg、Cr+6、PBDE和PBB）。所有部件和元件均经过严格挑选，符合RoHS要求。此
外，我们GIGABYTE一直致力于开发不使用国际上禁止的有毒化学品的产品。
GIGABYTE products have not intended to add and safe from hazardous substances (Cd, Pb, Hg, Cr+6, PBDE and PBB). The parts and components
have been carefully selected to meet RoHS requirement. Moreover, we at GIGABYTE are connuing our efforts to develop products that do not use
internaonally banned toxic chemicals.
Restricon of Hazardous Substances (RoHS) Direcve Statement
限制使用有害物质 (RoHS) 指令声明
California Proposion 65 Warning
WARNING:
This product contains a chemicals , including lead, known to the State of California to cause cancer and birth defects or other reproducve harm.
For more informaon, please visit: hp://www.p65warnings.ca.gov/
Baery Warning:
Incorrectly installing a baery or using incompable baery may increase the risk of ifre explosion. Replace the baery only with
the same or equivalent type.
Do not disassemble, crush, punchture baeries.
Do not store or place your baery pack next to or in a heat source such as a fire, heatgenerang appliance, can or exhaust
vent. Heang baery cells to temperatures above 65oC (149oF) can cause explosion or fire.
Do not aempt to open or service baeries. Do not dispose of baeries in a fire or with household waste.
电池警告：
电池安装不当或使用不兼容的电池会增加火灾爆炸风险。更换电池时，只可使用相同或同等类型的电池。
请勿拆解、挤压、刺破电池。
请勿将电池存放或放置在热源中或旁边，如火源、产生热的设备、罐体或排气口。电池温度升至65oC (149oF)以上
可能导致爆炸或火灾。
请勿尝试打开或维修电池。电池废弃时，请勿投入火中或者作为家庭废弃物进行处理。
依照中华人民共和国的有毒有害物质的限制要求(China RoHS)提供以下的表格：
中华人民共和国电子信息产品中有毒有害物质或元素的名称及含量标识格式
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1
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2
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