ハードウェアマニュアル
vii
目次
はじめに ..................................................................................................................................................i
◆特長 ...............................................................................................................................................i
サポートのご案内.................................................................................................................................ii
◆ホームページ..............................................................................................................................ii
◆総合インフォメーション(お問い合わせ窓口)......................................................................ii
◆修理窓口.....................................................................................................................................iii
◆製品貸出サービス.....................................................................................................................iii
◆各種セミナ.................................................................................................................................iii
◆FA/LA無料相談コーナー.........................................................................................................iii
◆システム受託開発、OEM受託 ...............................................................................................iii
安全にご使用いただくために ...........................................................................................................iv
◆安全情報の表記.........................................................................................................................iv
◆取り扱い上の注意.....................................................................................................................iv
目次 .......................................................................................................................................................vii
第1章 仕様 1
仕様 .........................................................................................................................................................1
外形寸法 .................................................................................................................................................4
第2章 各部の機能 5
各部の名称 .............................................................................................................................................5
◆シリアルポートインターフェイス(COM1、COM2) ...........................................................6
◆イーサネット(UTP) ...................................................................................................................7
◆PCMCIA (PCMCIA) ...................................................................................................................8
◆USBポート(USB) .......................................................................................................................8
◆汎用I/Oポート(I/O)....................................................................................................................9
◆ACアダプタジャック..............................................................................................................10
◆電源入力コネクタ....................................................................................................................11
◆外部スピーカ出力端子(SPK).................................................................................................11
◆タッチパネル............................................................................................................................12
◆DIP-SWの設定..........................................................................................................................12
◆LED表示 ....................................................................................................................................13
第3章 ハードウェアのセットアップ 15
◆設置条件....................................................................................................................................15
◆カード抜け防止金具 ...............................................................................................................15
◆バックライトの交換について ...............................................................................................16
◆本体固定金具取り付け方法 ...................................................................................................16
◆OS動作の設定用DIP-SW(SW2)操作カバーの取り外し方.................................................18
◆ACアダプタ抜け防止金具......................................................................................................18