ハードウェアマニュアル
vii
目次
はじめに ..................................................................................................................................................i
◆特長 ...............................................................................................................................................i
サポートのご案内.................................................................................................................................ii
◆ホームページ..............................................................................................................................ii
◆総合インフォメーション(お問い合わせ窓口)......................................................................ii
◆修理窓口......................................................................................................................................ii
◆製品貸出サービス.....................................................................................................................iii
◆各種セミナ.................................................................................................................................iii
◆FA/LA無料相談コーナー.........................................................................................................iii
◆システム受託開発、OEM受託 ...............................................................................................iii
安全にご使用いただくために ...........................................................................................................iii
◆安全情報の表記.........................................................................................................................iii
◆取り扱い上の注意.....................................................................................................................iv
目次 .......................................................................................................................................................vii
第1章 概要 1
仕様 .........................................................................................................................................................1
外形寸法 .................................................................................................................................................4
第2章 各部の機能 5
◆各部の名称..................................................................................................................................5
◆シリアルポートインターフェイス(COM1、COM2) ...........................................................7
◆イーサネット(UTP) ...................................................................................................................8
◆PCMCIA (PCMCIA)...................................................................................................................9
◆USBポート(USB) .......................................................................................................................9
◆汎用I/Oポート(I/O)..................................................................................................................10
◆ACアダプタジャック..............................................................................................................13
◆電源入力コネクタ....................................................................................................................13
◆外部スピーカ出力端子(SPK).................................................................................................14
◆タッチパネル............................................................................................................................14
◆DIP-SWの設定..........................................................................................................................15
◆LED表示 ....................................................................................................................................16
第3章 ハードウェアのセットアップ 17
◆設置条件....................................................................................................................................17
◆カード抜け防止金具 ...............................................................................................................17
◆バックライトの交換について ...............................................................................................18
◆本体固定金具取り付け方法 ...................................................................................................18
◆OS動作の設定用DIP-SW(SW2)操作カバーの取り外し方.................................................19
◆ACアダプタ抜け防止金具......................................................................................................20