限用物質含有情況標示聲明書
設備名稱： 鑽石鑽孔機 ，型號（型式）：DD 200
單元Ｕnit
限用物質及其化學符號
鉛Lead
(Pb)
汞Mercury
(Hg)
鎘Cadmium
(Cd)
六價鉻
Hexavalent
chromium
(Cr
+6
)
多溴聯苯
Polybrominate
d biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
電子原件
(電路版, 開關, 電
線)
Electronics (pcb,
switch, wiring)
ㅡ
○
ㅡ
○
○
○
馬達
Motor
ㅡ
○
○
○
○
○
電源線
Power cord
ㅡ
○
○
○
○
○
緊固元件
Fastener elements
○
○
○
○
○
○
金屬部件
Metal
parts
ㅡ
○
○
○
○
○
電源供應系統
Power supplies
ㅡ
○
○
○
○
○
備考1.〝超出0.1 wt %〞及〝超出0.01 wt %〞係指限用物質之百分比含量超出百分比含量基準
值。
備考2.〝○〞係指該項限用物質之百分比含量未超出百分比含量基準值。
備考3.〝－〞係指該項限用物質為排除項目。
Equipment name
Type designation (Type)
Restricted substances and its chemical symbols
Declaration of the Presence Condition of the Restricted Substances Marking
Note 1：“Exceeding 0.1 wt %” and “exceeding 0.01 wt %” indicate that the percentage content of the restricted substance exceeds the
reference percentage value of presence condition.
Note 2：“○” indicates that the percentage content of the restricted substance does not exceed the percentage of reference value of presence.
Note 3：The “−” indicates that the restricted substance corresponds to the exemption.
Printed: 09.11.2017 | Doc-Nr: PUB / 5383821 / 000 / 00
-
1
